Responsibility工作職責(zé)：
· Design, develop and implement lab and production test solutions for mobile chipsets or user equipments, base stations, based on R&S mobile radio testers, signal generators and analyzers, incl. chipset verification scenarios, phone calibration and final tests, tests of complex signals of smart terminals, customer-specific test, and so on. 基于羅德與施瓦茨公司的綜合測試儀、信號源與頻譜儀等儀表，設(shè)計(jì)、開發(fā)與實(shí)現(xiàn)針對移動(dòng)通信芯片或終端、基站的實(shí)驗(yàn)室與生產(chǎn)測試解決方案，例如芯片驗(yàn)證、手機(jī)校準(zhǔn)與終測、智能終端多種信號測試、客戶定制測試等；
· Support R&S’ teams and 3rd-party partners technically and resourcefully in application solution implementation, delivery and promotion. 對R&S團(tuán)隊(duì)及第3方合作伙伴，在應(yīng)用解決方案的實(shí)現(xiàn)、交付與推廣提供技術(shù)性與資源性支持；
· Establish and maintain communication links to customers’ product groups.與客戶及其產(chǎn)品團(tuán)隊(duì)建立并保持有效的溝通聯(lián)系；
Experience/qualifications職位要求：
· B.A./B.S. or above majored in wireless communication, electronic engineering or RF/microwave. 重點(diǎn)大學(xué)學(xué)士以上學(xué)位，無線通信、電子工程或射頻與微波專業(yè)；
· A minimum of 5 years of relevant work experience.至少5年相關(guān)工作經(jīng)驗(yàn)；
· Proven ability designing, implementing, debugging and understanding complex hardware/software systems and projects.必須具備理解、設(shè)計(jì)、實(shí)現(xiàn)、調(diào)試、測試復(fù)雜軟硬件系統(tǒng)和項(xiàng)目的能力；
· Proven experience in OOP (e.g. C++) design techniques and implementation.必須具備基于C++的面向?qū)ο笤O(shè)計(jì)技術(shù)與經(jīng)驗(yàn)；
· Proven experience in test and measurement of mobile chipset, user terminals or base stations of 2G//3G/LTE. 必須具備2G/3G/LTE芯片、終端或基站的測試與調(diào)試經(jīng)驗(yàn)；
· Proven experience in teamwork. 必須具備團(tuán)隊(duì)工作精神；
· Ability to travel to Chinese locations. 適應(yīng)在國內(nèi)出差。
